Semiconductor device

ABSTRACT

A semiconductor device includes: an FET structure that is formed next to a looped trench on a semiconductor substrate and that has an n +  emitter region and an n −  drain region facing each other in the depth direction of the looped trench across a p-type base region; a p-type floating region formed on the side of the looped trench opposite to the FET structure; and an emitter connecting part that is electrically connected to the n +  emitter region and a trench gate provided in the same trench, the emitter connecting part and the trench gate being insulated from each other by the looped trench. The trench gate faces the FET structure, and the emitter connecting part faces the p-type floating region, across an insulating film.

BACKGROUND OF THE INVENTION Technical Field

The present invention relates to a semiconductor device having elementssuch as IGBTs (insulated gate bipolar transistors), and a semiconductordevice having a gate pad.

Trench gate IGBTs, which have a high saturation voltage V_(CE)(sat) andshort-circuit resistance between collector emitters, conventionally havep-type floating regions. The p-type floating regions are generallydiffused inside the drift layer so as to contact the trench gates. Thisdrift layer is an epitaxial wafer or a pull-up wafer havingapproximately an equivalent resistance thereto.

RELATED ART DOCUMENTS Patent Documents

Non-Patent Document 1: Satoru Machida, Takahide Sugiyama, MasayasuIshiko, Satoshi Yasuda, Jun Saito, Kimimori Hamada. Investigation ofCorrelation between Device Structures and Switching Losses of IGBTs. TheInstitute of Electrical Engineers of Japan Electronics Material ResearchGroup Data (EFM-09, 16-26, 28-29), 55-59

Non-Patent Document 2: So Watanabe, Mutsuhiro Mori, Taiga Arai, KohsukeIshibashi, Yasushi Toyoda, Tetsuo Oda, Takashi Harada, Katsuaki Saito.1.7 kV Trench IGBT with Deep and Separate Floating p-Layer Designed forLow Loss, Low EMI Noise, and High Reliability. The Institute ofElectrical Engineers of Japan Electronic Devices Research Group Data(EDD-11, 66-83), 67-71

Patent Document 1: Japanese Patent No. 4785334

SUMMARY OF THE INVENTION

In an IGBT having a structure in which the p-type floating regions andthe trench gates are electrically connected, however, there is a highamount of stray capacitance in the area connecting the respective trenchgates and the p-type floating regions, which causes an increase inswitching loss. There is also a problem that switching noise occurs whenthis IGBT is switched on.

It cannot yet be said that technology for alleviating these types ofswitching loss and switching noise problems exists without sacrificingvarious characteristics of the semiconductor device such as ON voltageand short-circuit resistance.

Furthermore, in a semiconductor device having a gate pad, it is knownthat inrush current (di/dt) occurs when voltage is applied to this gatepad. This inrush current tends to flow through the gate pad or thesurface of the gate metal wiring lines connected to the gate pad.Therefore, the inrush current flows into the gate structure close to thegate pad as surface current, which could result in the gate structureturning ON locally. The occurrence of this type of surface current doesnot merely cause variation in the applied current between the pluralityof gate structures; it is also a cause of switching loss when therespective IGBTs are turned ON.

An LC resonant circuit is ordinarily formed by parasitic inductance andparasitic capacitance, so if surface current flows to the gate padformed around the gate structure and the gate metal wiring lines, theswitching of the gate structure will trigger resonance noise. As aresult, switching loss during switching-ON increases.

Thus, there is demand for a semiconductor device that can effectivelyrestrict inrush current and reduce switching loss and generation ofresonance noise.

One aim of the present invention is to provide a semiconductor devicehaving IGBTs that reduce switching loss and the occurrence of switchingnoise, and that can have excellent ON voltage and short-circuitresistance.

Another aim of the present invention is to provide a semiconductordevice that can effectively restrict inrush current and reduce switchingloss and the generation of switching noise and resonance noise.

Another aim of the present invention is to provide a semiconductordevice that has at least one of the desirable characteristics listedabove in accordance with the above-mentioned aims.

Additional or separate features and advantages of the invention will beset forth in the descriptions that follow and in part will be apparentfrom the description, or may be learned by practice of the invention.The objectives and other advantages of the invention will be realizedand attained by the structure particularly pointed out in the writtendescription and claims thereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described, in oneaspect, the present disclosure provides a semiconductor device,including: a semiconductor layer having a trench formed therein; afield-effect transistor structure formed adjacent to the trench, thefield-effect transistor structure having an emitter region and a drainregion that face each other in a depth direction of the trench across abase region; a floating region formed on a side of the trench oppositeto the field-effect transistor; an insulating film formed on an innersurface of the trench; and a trench gate and an emitter connecting partprovided in the trench and insulated from each other in the trench, theemitter connecting part being electrically connected to the emitterregion, wherein the trench gate faces the field-effect transistorstructure across the insulating film, and wherein the emitter connectingpart faces the floating region across the insulating film.

With this configuration, the capacitance caused by the trench contactingthe floating region can be the capacitance of the junction area betweenthe emitter connecting part and the floating region (capacitance betweencollector-emitter connecting part). This makes it so the trench gate isnot affected by the junction with the floating region. Accordingly, itis possible to reduce switching loss more than in conventionalsemiconductor devices in which the floating region and the trench gateare joined together. Meanwhile, if the drain region of the FET structurethat the trench gate faces is grounded together with the collectorregion, then changes in capacitance between the trench gate and thedrain region can be stably maintained during switching. As a result, itis possible to suppress the occurrence of switching noise.

The inventions of the present application have researched asemiconductor device (hereinafter, referred to as “the semiconductordevice of the reference example”) having IGBTs in which a plurality oftrench emitters are formed between mutually adjacent trench gates, andthe trench emitters are electrically joined to the floating regions. Inthis structure, there is no joining region between the trench gates andthe floating regions, and thus it is possible to predict an improvementin the switching loss and switching noise described above. Thesemiconductor device of the reference example, however, has FETstructures formed in the respective areas between the trench gates andthe trench emitters. Accordingly, the trench gates and the trenchemitters face each other across the FET structures. This reduces thecarrier storage effect caused by the FET structures being sandwiched bythe trench gates, and thus leads to a reduction in carrier density inthe semiconductor layer. This results in an increase in drift resistancein the drain region and a susceptibility to increases in ON voltage.

In contrast, in one aspect of the present invention described above, thetrench gates can be made to face each other through the insulating filmand the FET structures; therefore, it is possible to increase thecarrier storage effect caused by the trench gates. This increasescarrier density in the semiconductor layer, thus making it possible toreduce drift resistance in the drain region. This can help reduce ONvoltage of the semiconductor device.

Furthermore, in one aspect of the present invention described above,unlike in the semiconductor device of the reference example, the trenchgates and the emitter junctions are formed in the same respectivetrenches, and thus it is not necessary to separately form trench gatesand trench emitters. Accordingly, the number of FET structures needed tobe formed can be reduced. In other words, the number of contact openingsneeded for connecting the FET structures can be reduced. This candecrease the contact aperture ratio and make it possible to effectivelysuppress a decrease in short-circuit resistance of the semiconductordevice.

In the above-mentioned semiconductor device, the trench gate may beformed adjacent to a side face of the trench in a cross-sectionperpendicular to a lengthwise direction of the trench, the emitterconnecting part may be formed adjacent to another side face of thetrench in the cross-section perpendicular to the lengthwise direction ofthe trench, and the semiconductor device further may include a centerinsulating film interposed between the trench gate and the emitterconnecting part.

In the above-mentioned semiconductor device, the trench gate and theemitter connecting part may be formed in a film shape along respectiveside faces of the trench

The above-mentioned semiconductor device may further include a gatecontact trench formed in the semiconductor layer and continuing from aside face of the trench adjacent to the trench gate; and an emittercontact trench formed in the semiconductor layer and continuing from aside face of the trench adjacent to the emitter connecting part, and thegate contact trench and the emitter contact trench may have a width thatis narrower than the trench.

With this configuration, in order to obtain a configuration in which therespective junctions are adjacent to one or the other side of thetrench, the electrode material for the trench gate and the emitterconnecting part is deposited along the inner surface of the trench, andat this time the electrode material deposited on one or the other sideface is integrated inside a gate contact trench or an emitter contacttrench that have smaller widths than the trench. This makes it possibleto completely fill the gate contact trench and the emitter contacttrench with this electrode material. Thus, the area of the electrodematerial when seen from above the thickness direction of the respectivecontact trenches is equal to at least the diameter (width) of therespective contact trenches, which allows for contact to be made withease.

In the above-mentioned semiconductor device, the trench may be formed ina loop that defines an inner area where the floating region is disposedand an outer area where the field-effect transistor structure isdisposed, the gate contact trench may be drawn out from the loopedtrench to the outer area, and the emitter contact trench may be drawnout from the looped trench to the inner area.

In the above-mentioned semiconductor device, the field-effect transistorstructure may be provided in a plurality in stripe shapes as seen in aplan view from a direction normal to a surface of the semiconductorlayer, the looped trench may be disposed in an area between the adjacentfield-effect transistor structures, the gate contact trench of thelooped trench provided in this area may be drawn outward from an end ofthe looped trench in a lengthwise direction of the stripe shape, theemitter contact trench of the looped trench provided in this area may bedrawn inward from the end of the looped trench in the lengthwisedirection of the stripe shape, the gate contact trench and the emittercontact trench being drawn in opposite directions to each other, and thesemiconductor device may further include: a gate finger formed so as togo across the gate contact trench around an active area where thestripe-shaped field-effect transistor is formed, the gate finger beingelectrically connected to the trench gate; and an emitter electrodeformed so as to cover the emitter contact trench above the active areaand at a gap from the gate finger, the emitter electrode beingelectrically connected to the emitter connecting part.

In the above-mentioned semiconductor device, the floating region may beformed so as to partially wrap around a bottom of the trench.

With this configuration, the floating region is formed so as topartially wrap around the bottom of the trench; therefore, it ispossible to alleviate collector-emitter voltage from burdening thetrench during switching OFF operations. Thus, it is possible to suppressdevice failure due to sudden changes in voltage (dv/dt). This allows forthe short-circuit resistance of the semiconductor device to bemaintained. Furthermore, the short-circuit resistance can be improved bythe floating region being deeper than the base region, and the baseregion can be made shallow; therefore, it is possible to shorten thechannel length by appropriately designing the depth of the base region,thereby suppressing a rise in ON voltage.

The above-mentioned semiconductor device may further include a secondtrench formed in the semiconductor layer, the second trench reaching atleast the floating region; and a second emitter connecting part disposedin the second trench across an insulating film, the second emitterconnecting part being electrically connected to the emitter region.

In the above-mentioned semiconductor device, the floating region may beformed at a same depth as the base region, and the second trench may beformed so as to penetrate the floating region.

In the above-mentioned semiconductor device, the second trench may beformed at a same width as the trench, and the second emitter connectingpart may further include a pair of connectors that are insulated fromeach other in the second trench.

With this configuration, the second trench can be formed in the samestep in which the trench is formed by merely changing the layout of themask. Furthermore, the second trench is formed having the same width asthe trench, thereby making it possible to form the second emitterconnecting part in the same step in which the trench gate and theemitter connecting part are formed. This results in being able to formthe second trench and the second emitter connecting part withoutcomplicating the manufacturing process.

In the above-mentioned semiconductor device, the second trench may beformed at a width that is less than the trench, and the second emitterconnecting part may be embedded as one integral member in the secondtrench.

Even with this configuration, the second emitter connecting part can beformed in the same step in which the trench gate and the emitterconnecting part are formed.

In another aspect, the present disclosure provides a semiconductordevice, including: a semiconductor layer having an active area in whicha plurality metal-insulated-semiconductor gate structures are arrayed; asurface gate metal that is disposed on the semiconductor layer and thathas a pad section for receiving external power, and a wiring sectionextending around the active area and electrically connected torespective gates of the plurality of metal-insulated-semiconductor gatestructures, the surface gate metal having a removal area for isolatingat least a portion of the pad section and the wiring section; and leadout wiring that is lead out from the pad section to the adjacent wiringsection across the removal section, the lead out wiring being made of amaterial that has a higher resistance than the gate metal.

In the semiconductor device of the other aspect of the present inventiondescribed above, current flows through lead out wiring when flowing fromthe pad section to the wiring section; therefore, it is possible torestrict current flowing into the wiring section caused by surfacecurrent. This makes it possible to suppress inrush current (di/dt)locally flowing to the gate of the MIS gate structures positioned closeto the pad section, thereby suppressing a situation in which the MISgate structures turn ON locally. As a result, it is possible to suppressvariation in the applied current between the plurality of MIS gatestructures regardless of distance from the pad section. Furthermore,because it is possible to suppress the MIS gate structures from turningON locally, it is also possible to suppress the switching of the MISgate structures triggering resonance noise. Therefore, it is possible toreduce switching loss caused by resonance noise during switching ON.

In a configuration of the aspect of the present invention describedabove, the removal area may be formed so as to surround the pad section.

In this case, surface current can be restricted in a location that isnear the pad section, thereby making it possible to effectively suppresslocal current flowing to the MIS gate structures near the pad section.

The wiring section may further include a line-shaped gate finger thatextends so as to surround the active area. With this configuration, thecurrent of the surface current that has been restricted will flow to thegate finger, and thus it is possible to suppress variation in currentalong the lengthwise direction of the gate finger.

The wiring section may further include a pad peripheral sectionintegrally formed with the gate finger and that surrounds the removalarea that surrounds the pad section. With this configuration, it ispossible to suppress current flowing to the gate of the MIS gatestructures without the going through the gate finger.

In the semiconductor device of the other aspect of the present inventiondescribed above, the plurality of the metal-insulated-semiconductor gatestructures may be formed in a stripe shape as seen in a plan view from adirection normal to a surface of the semiconductor layer, the gatefinger may be disposed so as to go across the stripe-shapedmetal-insulated-semiconductor gate structures, and the gate finger maycontact the gates of the metal-insulated-semiconductor gate structureson both lengthwise ends of the respective metal-insulated-semiconductorgate structures.

The pad section may be formed in a center of an area along the stripedirection of the metal-insulated-semiconductor gate structures, and thegate finger may extend along both sides along the stripe direction fromthe pad section and go across the stripe-shapedmetal-insulated-semiconductor gate structures.

In this configuration, the gate finger contacts the gate of the MIS gatestructures at a position that is relatively far from the pad section,thereby making it possible to restrict inrush current.

The semiconductor layer may be formed in a equilateral shape in a planview, the pad section may be formed on a corner of the equilateralsemiconductor layer, and the gate finger may be formed integrally withthe pad section and further include a first gate finger disposed so asto extend along the stripe direction of themetal-insulated-semiconductor gate structures and a second gate fingerthat is separated from the pad section through the removal area anddisposed so as to go across the metal-insulated-semiconductor gatestructures from the pad section.

In this configuration, the first gate finger makes contact with the gatein the MIS gate structure at a position that is relatively far from thepad section, thereby making it possible to restrict inrush current.Meanwhile, the second gate finger makes contact with the gate of the MISgate structure at a position that is relatively adjacent to the padsection, but the second gate finger is isolated from the pad section.Furthermore, the second gate finger is connected to the pad sectionthrough the lead out wiring, and thus it is possible to restrict theinrush current even if the inrush current flows to the pad section.

In the semiconductor device of the other aspect of the present inventiondescribed above, the removal area may selectively surround a portionaround the pad section.

In the semiconductor device of the other aspect of the present inventiondescribed above, the removal area may completely surround an entirety ofthe pad section.

With this configuration, it is possible to restrict surface current onthe entire area surrounding the pad section. This makes it possible toeffectively suppress local current flowing to the MIS gate structuresnear the pad section.

In the semiconductor device of the other aspect of the present inventiondescribed above, the lead out wiring may connect the pad section and thewiring section via a bottom part of the removal area. With thisconfiguration, it is possible to form the lead out wiring in the samestep as the gates of the MIS gate structures. Therefore, it is possibleto simplify the manufacturing process. Accordingly, in this case, it ispreferable that the lead out wiring be made of the same material as thegates in the MIS gate structures.

The wiring section may be made of a metal material having Al as a maincomponent thereof, and the lead out wiring and the gates of themetal-insulated-semiconductor gate structures may be made ofpolysilicon.

In the semiconductor device of the other aspect of the present inventiondescribed above, an insulated gate bipolar transistor having a portionof the metal-insulated-semiconductor gate structure may be formed in thesemiconductor layer.

This insulated gate bipolar transistor may include a trench-gateinsulated gate bipolar transistor.

The semiconductor device in one aspect of the present inventiondescribed above and the various aspects thereof can be combined withsemiconductor device of another aspect of the present inventiondescribed above and the various aspects thereof to exhibit the samerespective effects and to exhibit synergy effects thereof. These diversecombinations are also aspects of the present invention.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory, andare intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of a semiconductor device according toEmbodiment 1 of the present invention.

FIG. 2A is a schematic cross-sectional view of the semiconductor devicein FIG. 1.

FIG. 2B is a schematic cross-sectional view of a portion of trenches inthe semiconductor device shown in FIG. 1.

FIG. 3 is a schematic cross-sectional view of a semiconductor deviceaccording to a reference example.

FIG. 4 is a graph comparing steady loss in the semiconductor deviceshown in FIG. 1 and the semiconductor device of the reference example.

FIG. 5 is a graph comparing carrier density in the semiconductor deviceshown in FIG. 1 and the semiconductor device of the reference example.

FIG. 6A is a cross-sectional view for explaining one example of amanufacturing step for the semiconductor device in FIG. 1.

FIG. 6B is a view of the next manufacturing step after FIG. 6A.

FIG. 6C is a view of the next manufacturing step after FIG. 6B.

FIG. 6D is a view of the next manufacturing step after FIG. 6C.

FIG. 6E is a view of the next manufacturing step after FIG. 6D.

FIG. 6F is a view of the next manufacturing step after FIG. 6E.

FIG. 6G is a view of the next manufacturing step after FIG. 6F.

FIG. 6H is a view of the next manufacturing step after FIG. 6G.

FIG. 6I is a view of the next manufacturing step after FIG. 6H.

FIG. 6J is a view of the next manufacturing step after FIG. 6I.

FIG. 6K is a view of the next manufacturing step after FIG. 6J.

FIG. 7 is a schematic cross-sectional view of a semiconductor deviceaccording to Embodiment 2 of the present invention.

FIG. 8 is a schematic cross-sectional view of a semiconductor deviceaccording to Embodiment 3 of the present invention.

FIG. 9 is a schematic cross-sectional view of a semiconductor deviceaccording to Embodiment 4 of the present invention.

FIG. 10 is a schematic plan view of a semiconductor device according toEmbodiment 5 of the present invention.

FIG. 11 is a schematic plan view for explaining lead out wiring of thesemiconductor device according to Embodiment 5.

FIG. 12 is a plan view in which the lead out wiring of the semiconductordevice shown in FIG. 10 have been magnified.

FIG. 13A is a cross-sectional view of FIG. 12 along XIIIA-XIIIA.

FIG. 13B is an electrical circuit map for explaining the electricalstructure of the semiconductor device shown in FIG. 10.

FIG. 14A is a graph showing switching characteristics of thesemiconductor device shown in FIG. 10.

FIG. 14B is a graph showing switching characteristics of thesemiconductor device shown in FIG. 10.

FIG. 14C is a graph showing switching characteristics of thesemiconductor device shown in FIG. 10.

FIG. 15 is a schematic plan view of a semiconductor device according toEmbodiment 6.

FIG. 16 is a schematic plan view for explaining lead out wiring of thesemiconductor device according to Embodiment 6.

FIG. 17 is a schematic cross-sectional view of a modification example ofthe semiconductor device according to Embodiment 1.

FIG. 18 is a circuit map for explaining an inverter circuit using thesemiconductor device according to Embodiments 1 to 4.

FIG. 19 is a schematic cross-sectional view of a modification example ofthe semiconductor device according to Embodiments 5 and 6.

FIG. 20 is a circuit map for explaining an inverter circuit using thesemiconductor device according to Embodiments 5 and 6.

Below, embodiments of the present invention will be explained in detailwith reference to appended drawings.

FIG. 1 is a schematic plan view of a semiconductor device 1 according toEmbodiment 1 of the present invention.

The semiconductor device 1 is formed in an equilateral shape in a planview as seen from the direction normal to the surface thereof(hereinafter, referred to as simply a “plan view”). A gate finger 2 anda gate pad 3 are formed on the periphery of this surface. In a planview, the gate finger 2 is formed in a substantially square loop shapealong the periphery of the semiconductor device 1. An active area 4 isformed on the area surrounding the gate finger 2.

The gate pad 3, which has a substantially square shape in a plan view,is disposed in the center of the lengthwise direction of gate finger 2following one side thereof. The gate pad 3 is formed so as to integrallycontinue from the gate finger 2. Bonding wiring (not shown) is connectedto the gate pad 3, and this supplies power to the semiconductor device1. The gate finger 2 and the gate pad 3 are made of a metal materialhaving Al as the main component thereof, for example. In the presentembodiment, an example is described in which the gate pad 3 is disposedin the center of the lengthwise direction of an area along one side ofthe semiconductor device 1, but the gate pad 3 may be formed on onecorner of the gate finger 2.

A removal area 5 for preventing the gate finger 2 and the gate pad 3from contacting an emitter electrode 6 is formed in an area surroundedby the gate finger 2 and the gate pad 3. The removal area 5 is formed ina loop shape in a plan view along the gate finger 2 and the gate pad 3.The emitter electrode 6 has a portion thereof selectively formed in arecessed equilateral shape in a plan view so as to cover the areasurrounded by the removal area 5. The gate pad 3 is disposed in therecessed area of the emitter electrode 6. The emitter electrode 6 isformed of the same metal material as the gate finger 2 and the gate pad3, for example.

A plurality of FET structures 8 constituting singe cells of IGBTs(insulated gate bipolar transistors) are formed in the active area 4 ina stripe shape. Areas having a uniform width are disposed between therespective FET structures 8, and a looped trench 10 is formed in each ofthese areas. Thus, the FET structures 8 and the looped trenches 10 arealternately formed in the active area 4.

The looped trenches 10 have a closed curve structure formed in arectangular loop shape, with the long side thereof being along thedirection of the stripes. A p-type floating region 9 (the area shown bythe dotted line in FIG. 1) is formed inside each of the areas surroundedby the looped trenches 10.

The shape of the looped trenches is not limited to a rectangular loopshape in a plan view, and any shape may be used as long as the shapeforms a loop. The looped trenches 10 may have an elliptical shape in aplan view, for example.

A gate contact trench 11 and an emitter contact trench 12 arerespectively formed on every lengthwise end of the looped trenches 10.The gate contact trenches 11 and the emitter contact trenches 12 aredrawn out inside and outside the looped trenches 10 so as to face eachother from the respective ends thereof.

The gate contact trenches 11 and the emitter contact trenches 12 are allformed in a bridge-like shape that integrally continues from therespective looped trenches 10 in a plan view. More specifically, thegate contact trenches 11 and the emitter contact trenches 12 are allformed in a bridge-like shape on the short sides of the looped trenches10 (in the present embodiment, this bridge-like shape is an angularbridge-like shape that includes a pair of columns facing each other anda support part that joins this pair of columns). The gate finger 2 isdisposed so as to go across the gate contact trenches 11 formed on therespective looped trenches 10 (specifically, to cover the support partof the gate contact trenches 11).

Next, a cross-sectional view of the semiconductor device 1 will beexplained with reference to FIGS. 2A and 2B. FIG. 2A is a schematiccross-sectional view of the semiconductor device 1 in FIG. 1. FIG. 2B isa schematic cross-sectional view of one end of the looped trench 10 ofthe semiconductor device 1 shown in FIG. 1. FIG. 2A is a cross-sectionalview of when the semiconductor device 1 has been cut in a directionperpendicular to the stripes of the looped trenches 10. FIG. 2B is across-sectional view of when the semiconductor device 1 has been cut ina direction going across the short sides of the looped trenches 10, thegate contact trenches 11, and the emitter contact trenches 12.

As shown in FIGS. 2A and 2B, the semiconductor device 1 has asemiconductor substrate 15, which is one example of a semiconductorlayer of the present invention. The semiconductor substrate 15 is an n⁻silicon substrate, for example, and is formed of a p⁺ collector region16 and an n⁻ drain region 17 in this order from the rear surface sidethereof. The p⁺ collector region 16 is formed on the entire rear surfaceof the semiconductor substrate 15, and the n⁻ drain region 17 is formedon the entire front surface of the semiconductor substrate 15.

The dopant concentration of the p⁺ collector region 16 is 1×10¹⁵ cm⁻³ to2×10¹⁹ cm⁻³, for example. The p-type dopant can be B (boron), Al(aluminum), or the like, for example (the same for hereinafter). Thedopant concentration of the n⁻ drain region 17 is 1×10¹⁵ cm⁻³ to 5×10¹⁷cm⁻³, for example. The n-type dopant can be N (nitrogen), P(phosphorous), As (arsenic), or the like, for example (the same forhereinafter).

The looped trenches 10 are dug in the thickness direction of the surfaceof the semiconductor substrate 15. The looped trenches 10 are formedwith a uniform width. The side faces of the looped trenches 10 aresubstantially perpendicular to the surface of the semiconductorsubstrate 15. The bottoms of the looped trenches 10 are formed so as tobe rounded from the side faces of the looped trenches 10. The p-typefloating regions 9 are formed in the area demarcated by the loopedtrenches 10.

The p-type floating regions 9 are semiconductor areas that areelectrically floating. In the present embodiment, the p-type floatingregion 9 is formed such that the boundary thereof is below the loopedtrenches 10, and the bottom of the p-type floating region 9 is deeperthan the bottom of the looped trenches 10. Specifically, the outer edgeof the bottom of the p-type floating region 9 is below a centerinsulating film 21, which will be described later. Due to this, thep-type floating region 9 is formed under an emitter connecting part 20,which is described later, but not under the trench gates 19. The dopantconcentration of the p-type floating region 9 is 5×10¹⁵ cm⁻³ to 1×10¹⁸cm⁻³, for example.

The FET structure 8 (the single cell 7) is formed in the area betweenthe adjacent looped trenches 10 (the outer area of the looped trenches10). Each of the FET structures 8 includes n⁺ emitter regions 31 and then⁻ drain region 17, which face each other across a p-type base region 28in the depth direction of the looped trenches 10.

The p-type base region 28 is shared by the adjacent looped trenches 10that are closest to each other. In the present embodiment, the interfaceof the p-type base region 28 and the n⁻ drain region 17 is configured tobe the center in the depth direction of the looped trenches 10 or abovethis center, and the p-type base regions 28 are diffused relativelyshallowly on the semiconductor substrate 15. The dopant concentration ofthe p-type base region 28 is 1×10¹⁶ cm⁻³ to 1×10¹⁸ cm⁻³, for example.

Contact trenches 29 that are dug from the surface of the semiconductorsubstrate 15 are formed in the p-type base layer 28. The contacttrenches 29 have a uniform width along the lengthwise direction of thelooped trenches 10. A p⁺ base contact region 30 is formed at the bottomof each of the contact trenches 29. The dopant concentration of the p⁺base contact region 30 is 5×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³, for example.

The n⁺ emitter regions 31 are formed between the contact trench 29 andthe respective looped trenches 10 on the surface of each of the p-typebase regions 28. Each side of the contact trench 29 has one of n⁺emitter regions 31, and each of these n⁺ emitter regions 31 is exposedto the respective side faces of the contact trench 29. The dopantconcentration of the n⁺ emitter region 31 is 1×10¹⁹ cm⁻³ to 5×10²⁰ cm⁻³,for example.

As shown in FIGS. 2A and 2B, an insulating film 18 made of a siliconoxide film, for example, is formed on the inner surface (side faces andbottom) of the semiconductor substrate 15 and the respective loopedtrenches 10. The trench gates 19 and the emitter connecting parts 20 areformed on the inner side of the insulating film 18 in the loopedtrenches 10. The trench gates 19 and the emitter connecting parts 20 areformed in the looped trenches 10 with gaps therebetween and areinsulated from each other. More specifically, the trench gates 19 andthe emitter connecting parts 20 are formed in a film-like shape alongthe inner side faces and the outer side faces of the looped trenches 10in the cross section shown in FIGS. 2A and 2B. Due to this, there is aspace defined by the respective rear surfaces of the trench gates 19 andthe emitter connecting parts 20 (the surface opposite to the surface incontact with the looped trench 10) in the center of the width directionof the looped trenches 10. This space is completely filled by the centerinsulating film 21 up to the opening end of the looped trench 10, whichinsulates the trench gate 19 from the emitter connecting part 20.

The trench gate 19 is formed in a substantially looped square shape in aplan view so as to surround the emitter connecting part 20. In otherwords, the trench gate 19 is formed on the outer area side of the loopedtrench 10 and forms a portion of the FET structure 8 through theinsulating film 18. The trench gate 19 is made of an electrode materialsuch as polysilicon, for example.

The emitter connecting part 20 is formed in a substantially loopedsquare shape in a plan view on the inner area side of the looped trench10. In other words, the emitter connecting part 20 is joined with thep-type floating region 9 through the insulating film 18. The emitterconnecting part 20 is made of the same material as the trench gate 19.

As shown in FIG. 2B, the gate contact trench 11 and the emitter contacttrench 12 are formed on the lengthwise end of the looped trench 10 at awidth W₂ that is narrower than a width W₁ of the looped trench 10. Thewidth W₁ of the looped trench 10 is 5 μm to 3.0 μm, for example, whereasthe width W₂ of the gate contact trench 11 and the emitter contacttrench 12 is 0.7 μm to 1.2 μm, for example. The gate contact trench 11and the emitter contact trench 12 may be formed at differing widths fromeach other within this numerical range.

The insulating film 18 is formed in a similar manner to the loopedtrenches 10 on the inner surface of the respective contact trenches 11and 12. An embedded gate electrode 24 is formed through the insulatingfilm 18 in the gate contact trench 11. The embedded gate electrode 24 isformed so as to integrally continue from the trench gate 19 formed inthe looped trench 10. An embedded emitter electrode 25 is formed throughthe insulating film 18 in the emitter contact trench 12. The embeddedemitter electrode 25 is formed so as to integrally continue from theemitter connecting part 20 formed in the looped trench 10.

The respective contact trenches 11 and 12 are completely filled by theembedded electrodes 24 and 25, and thus the area of polysilicon(electrode material) when the respective contact trenches 11 and 12 areviewed from a depth direction thereof is equal to at least the diameter(width) of the respective contact trenches 11 and 12. As a result, it ispossible to contact the respective embedded electrodes 24 and 25 withease.

As shown in FIGS. 2A and 2B, an interlayer film 34 is stacked on thesurface of the semiconductor substrate 15. Contact holes 35 thatintegrally continue from the contact trenches 29 are formed in theinterlayer film 34. As shown in FIG. 2B, an emitter contact hole 36 thatselectively exposes the embedded emitter electrode 25, and a gatecontact hole 37 that selectively exposes the embedded gate electrode 24are formed in the interlayer film 34. The interlayer film 34 is aninsulating material made of tetraethyl orthosilicate (TEOS), boronphosphorous silicate glass (BPSG), silicon oxide (SiO₂), or the like,for example.

The emitter electrode 6, the gate finger 2, and the gate pad 3 (seeFIG. 1) are formed on the interlayer film 34.

The emitter electrode 6 enters the contact trenches 29 through thecontact holes 35 and is connected to the n⁺ emitter regions 31 on theside faces of the contact trenches 29. The emitter electrode 6 isconnected to the p-type base regions 28 through the p⁺ base contactregions 30 at the bottom of the contact trenches 29.

The emitter electrode 6 also enters the emitter contact holes 36 and isconnected to the embedded emitter electrodes 25. Due to this, the powerfrom the emitter electrode 6 is supplied to the emitter connecting parts20 through the embedded emitter electrodes 25.

The gate finger 2 enters the gate contact holes 37 and is connected tothe embedded gate electrodes 24. Due to this, the power from the gatefinger 2 (gate pad 3) is supplied to the trench gates 19 through theembedded gate electrodes 24.

As described above and shown in FIG. 2A, with the semiconductor device1, the p-type floating regions 9 are disposed in the inner area of thelooped trenches 10, and thus, the emitter connecting parts 20 formed inthe inner area of the looped trenches 10 face the respective p-floatingregions 9. The trench gates 19 formed on the outer area side of thelooped trenches 10 are separated from the p-type floating regions 9 viathe emitter connecting parts 20 and the center insulating films 21.Therefore, the capacitance formed by the looped trenches 10 contactingthe p-type floating region 9 can be capacitance between the collectoremitter connecting parts. The trench gates 19, however, are not incontact with the p-type floating regions 9, and thus can be preventedfrom being affected by the capacitance from the trench gates 19 joiningwith the p-type floating regions 9. As a result, it is possible toeffectively reduce switching loss.

The n⁻ drain region 17, which the trench gates 19 face across theinsulating film 18, is grounded with the p⁺ collector region 16.Therefore, the change in capacitance between the trench gates 19 and then⁻ drain region 17 during switching will be stable, and thus lesssusceptible to noise generation. As a result, it is possible to reducenoise generation during switching.

When the characteristics of the semiconductor device 1 and thecharacteristics of a semiconductor device 41 according to the referenceexample shown in FIG. 3 were investigated, the graph shown in FIG. 4 andthe graph shown in FIG. 5 were obtained. Hereinafter, the configurationof the semiconductor device 41 according to the reference example ofFIG. 3 will be explained, and then the characteristics of thesemiconductor device 1 will be explained with reference to FIGS. 3 to 5.

FIG. 3 is a schematic cross-sectional view of the semiconductor device41 of the reference example. In FIG. 3, portions corresponding to theportions in FIG. 2A are assigned the same reference characters anddescriptions thereof will be omitted.

The semiconductor device 41 according to the reference example has IGBTswith a structure in which a plurality of trench emitters 43 are formedbetween mutually adjacent trench gates 42, and the trench emitters 43are joined with p-type floating regions 9. In FIG. 3, an example isshown in which two trench emitters 43 are formed between the mutuallyadjacent trench gates 42.

The trench gates 42 include gate electrodes 45 embedded in trenches 44through an insulating film 18, and the trench emitters 43 includeemitter electrodes 46 that are embedded in the trenches 44 through theinsulating film 18. FET structures 8 are formed in the areas between thetrench gates 42 and the trench emitters 43. In other words, in thesemiconductor device 41 according to the reference example, there is nojoining region of the trench gates 42 and the p-type floating regions 9,and contact trenches 29 and contact holes 35 are formed in accordancewith the areas where the respective FET structures 8 are formed.

FIG. 4 is a graph for explaining the respective steady losses of thesemiconductor device 1 shown in FIG. 1 and the semiconductor device 41shown in the reference example. FIG. 5 is a graph for explaining therespective carrier densities of the semiconductor device 1 shown in FIG.1 and the semiconductor device 41 shown in the reference example.

The graph in FIG. 4 shows the relationship between collector currentI_(C) (A) and voltage V_(CE) (V) between collector emitters, and thegraph in FIG. 5 shows the relationship between carrier density (1/cm⁻³)and the distance (μm) from the surface of the semiconductor substrate15. In the respective graphs in FIGS. 4 and 5, the characteristics ofthe semiconductor device 1 are shown with a solid line, and thecharacteristics of the semiconductor device 41 according to thereference example are shown with a dotted line.

As shown in FIG. 4, it can be confirmed that the collector current I_(C)of the semiconductor device 41 according to the reference example has asmooth ascent from start to saturation and reaches saturation while thevoltage V_(CE) between the collector emitters is relatively highly.

In contrast to this, the collector current I_(C) of the semiconductordevice 1 has a steep ascent from start to saturation and reachessaturation while the voltage V_(CE) between the collector emitters isrelatively low.

It can also be confirmed that the ON voltage of the semiconductor device1 is lower than the ON voltage of the semiconductor device 41 accordingto the reference example. Accordingly, the steady loss of thesemiconductor device 1 can be said to be lower than the steady loss ofthe semiconductor device 41 according to the reference example. ONvoltage is defined as the voltage V_(CE) between collector emittersrequired to push the rated current while the voltage necessary for theON state is applied between the gate emitters (while V_(GE) is applied).

Next, as shown in FIG. 5, if the carrier density of the semiconductordevice 1 is compared to the carrier density of the semiconductor device41 in the reference example, it is understood that the semiconductordevice 1 has a higher carrier density than the semiconductor device 41of the reference example from the surface of the semiconductor substrate15 to the rear surface thereof.

As shown in FIG. 3, according to the configuration of the semiconductordevice 41 of the reference example, there is no joining region betweenthe trench gates 42 and the p-type floating regions 9, and thus thetrench gates 42 are not affected by the capacitance between thecollector trench gates, and it is possible to improve the problems ofswitching loss and switching noise. With this type of configuration,however, the FET structures 8 are sandwiched by the trench gates 42 andthe trench emitters 43, and not sandwiched by only the adjacent trenchgates 42. Therefore, the carrier storage effect from the trench gates 42is reduced, and as shown in FIG. 5, this reduces the carrier density inthe semiconductor substrate 15, thus increasing drift resistance in then⁻ drain region 17. As a result, as shown in FIG. 4, the ON voltage ofthe IGBTs becomes comparatively higher.

In contrast, as shown in FIG. 2A, the configuration of the semiconductordevice 1 has the FET structures 8 sandwiched by the adjacent trenchgates 19, thus making it possible to increase the carrier storage effectfrom the trench gates 19. As shown in FIG. 5, this increases the carrierdensity in the semiconductor substrate 15, which allows for the driftresistance in the n⁻ drain region 17 to be reduced. As shown in FIG. 4,this enables a reduction in ON voltage of the IGBTs.

Although not shown, when the amount of noise switching that occurs inthe respective structures of the semiconductor device 1 and thesemiconductor device 41 of the reference example was tested throughsimulation, it was found that the noise in the semiconductor device 1was markedly lower than the semiconductor device 41 according to thereference example.

Furthermore, with the configuration of the semiconductor device 1,unlike in the semiconductor device 41 of the reference example, thetrench gate 19 and the emitter connecting part 20 are provided in thesame looped trench 10, and thus it is not necessary to form the trenchgates 42 and the trench emitters 43. Accordingly, the number of FETstructures 8 needed to be formed can be reduced. In other words, thenumber of contact trenches 29 (contact holes 35) needed to connect withthe FET structures 8 can be reduced. This makes it possible to reducethe contact aperture ratio and to effectively suppress a reduction inshort-circuit resistance of the IGBTs.

Next, the manufacturing process for the semiconductor device 1 will bedescribed with reference to FIGS. 6A to 6K. FIGS. 6A to 6K arecross-sectional views for explaining one example of the manufacturingprocess of the semiconductor device 1 in FIG. 1. FIGS. 6A to 6Krespectively correspond to FIG. 2A.

In order to manufacture the semiconductor device 1, first, as shown inFIG. 6A, the semiconductor substrate 15, which does not yet have the p⁺collector region 16 formed on the rear surface side thereof, isprepared. Next, an ion implantation mask 50 having openings therein isselectively formed on the semiconductor substrate 15 on areas where thep-type floating regions 9 will be formed. The p-type dopant is implantedinto the semiconductor substrate 15 through this ion implantation mask50. This forms ion implantation regions 56. After the ion implantationregions 56 are formed, the ion implantation mask 50 is removed.

Next, as shown in FIG. 6B, a hard mask 51 having openings therein isselectively formed on the semiconductor substrate 15 on areas where thelooped trenches 10, the gate contact trenches 11, and the emittercontact trenches 12 (see FIG. 2B) will be formed. The semiconductorsubstrate 15 is etched through this hard mask 51 to simultaneously formthe trenches 10, 11, and 12. After the trenches 10, 11, and 12 areformed, the hard mask 51 is removed.

Next, as shown in FIG. 6C, the surface of the semiconductor substrate 15undergoes a thermal oxidation treatment. This forms a sacrificial oxidefilm 57 constituted of a silicon oxide film on the surface of thesemiconductor substrate 15, including the inner surfaces (bottom andside faces) of the respective trenches 10, 11, and 12.

Next, as shown in FIG. 6D, an annealing treatment is performed on thesemiconductor substrate 15 covered by the sacrificial oxide film 57,thereby diffusing the p-type dopant inside the ion implantation regions56 (drive-in diffusion). This annealing treatment is performed such thatthe p-type dopant reaches the bottom of the looped trenches 10. At thistime, the sacrificial oxide film 57 is already formed on the innersurfaces of the looped trenches 10 before the drive-in diffusionprocess, thus making it possible to prevent ions escaping from the innersurfaces. This allows for the p-type dopant to be efficiently diffused,thereby forming p-type floating regions 9 that partially wrap around thebottom of the looped trenches 10.

Next, as shown in FIG. 6E, the sacrificial oxide film 57 is removed andthe insulating film 18 is formed on the surface of the semiconductorsubstrate 15 through a thermal oxidation treatment. Next, CVD (chemicalvapor deposition), for example, is used to deposit polysilicon on thesurface of the semiconductor substrate 15 to form a polysilicondeposition layer 52. The width W₂ of the gate contact trenches 11 andthe emitter contact trenches 12 is less than the width W₁ of the loopedtrenches 10 (W₂<W₁, see FIG. 2B). Therefore, as shown in FIG. 6E, thelooped trenches 10 of the width W₁ have the polysilicon deposition layer52 formed along the inner surface thereof, and the respective contacttrenches 11 and 12 have the polysilicon deposition layer 52 deposited onboth inner side faces thereof. As shown in FIG. 2B, it is possible tocompletely fill the respective contact trenches 11 and 12 with thepolysilicon deposition layer 52 and to obtain the embedded gateelectrodes 24 and the embedded emitter electrodes 25 that are embeddedin the respective contact trenches 11 and 12. Next, the surface of thepolysilicon deposition layer 52 is oxidized to form a polysilicon oxidefilm 53.

Next, as shown in FIG. 6F, anisotropic etching such as RIE (reactive ionetching), for example, is used to selectively remove the polysilicondeposition layer 52 formed on the surface of the semiconductor substrate15 and the bottom of the looped trenches 10 such that the polysilicondeposition layer 52 remains on the side faces of the looped trenches 10.This simultaneously forms the trench gates 19 and the emitter connectingparts 20.

Next, as shown in FIG. 6G, HDP-CVD (high density plasma CVD) or thelike, for example, is used to deposit SiO₂ on the surface of thesemiconductor substrate 15 so as to fill the looped trenches 10 (morespecifically, the areas between the trench gates 19 and the emitterconnecting parts 20). This forms a SiO₂ film 54.

Next, as shown in FIG. 6H, an etch-back process such as dry etching, forexample, is performed on the surface of the SiO₂ film 54 such that thissurface is substantially equal to the surface of the semiconductorsubstrate 15. This forms the center insulating film 21, which isinterposed between the respective trench gates 19 and the emitterconnecting parts 20.

Next, as shown in FIG. 6I, an ion implantation mask 55 is formed thathas openings selectively corresponding to areas where the p-type baseregions 28 and the n⁺ emitter regions 31 will be formed. The p-typedopant and n-type dopant are selectively implanted in the semiconductorsubstrate 15 through this ion implantation mask 55. This forms the FETstructures 8 that include the p-type base regions 28 and the n⁺ emitterregions 31. After the p-type base regions 28 and the n⁺ emitter regions31 are formed, the ion implantation mask 55 is removed.

Next, as shown in FIG. 6J, LP-CVD (low pressure CVD) or the like, forexample, is used to deposit TEOS onto the semiconductor substrate 15,thereby forming the interlayer film 34. Next, a hard mask (not shown)having openings selectively corresponding to areas where the contactholes 35, the emitter contact holes 36, and the gate contact holes 37(see FIG. 2B) will be formed is selectively formed on the interlayerfilm 34. An etching process is performed on the interlayer film 34through this hard mask to form the respective contact holes 35, 36, and37. The contact trenches 29 that are dug from the surface of thesemiconductor substrate 15 are formed in the p-type base regions 29 atthe same time that the respective contact holes 35, 36 and 37 areformed. After the contact trenches 29 are formed, the hard mask isremoved. Next, the p-type dopant is implanted into the p-type baseregions 28 through the contact trenches 29 to form the p⁺ base contactregions 30.

Next, as shown in FIG. 6K, the material for the emitter electrode 6 andthe gate finger 2 (gate pad 3) is deposited onto the interlayer film 34.Next, this material is patterned to simultaneously form the emitterelectrode 6 and the gate finger 2 (gate pad 3). Next, the p-type dopantis selectively implanted into the rear surface of the semiconductorsubstrate 15 to form the p⁺ collector region 16. This results in thesemiconductor substrate 15 having the p⁺ collector region 16 and the n⁻drain region 17 formed in this order from the rear surface thereof. Thesemiconductor device 1 is manufactured through the above-mentionedsteps.

FIG. 7 is a schematic cross-sectional view of a semiconductor device 61according to Embodiment 2 of the present invention. The semiconductordevice 61 of Embodiment 2 differs from the semiconductor device 1 inEmbodiment 1 in that p-type floating regions 62 are formed relativelyshallow instead of the p-type floating regions 9, and in that aplurality of emitter trenches 63 are formed in an area surrounded bylooped trenches 10. Other elements are similar to the semiconductordevice 1 according to Embodiment 1 described above. In FIG. 7, portionscorresponding to the portions in FIG. 2A are assigned the same referencecharacters and descriptions thereof will be omitted.

In the present embodiment, the p-type floating regions 62 are formed atthe same depth as p-type base regions 28. The plurality of emittertrenches 63, which are second trenches of the present embodiment, areformed in the areas surrounded by the looped trenches 10 so as topenetrate the p-type floating regions 62. In this embodiment, an exampleis shown in which two of the emitter trenches 63 are formed in each areasurrounded by the looped trenches 10, but more than two of the emittertrenches 63 may be formed. A configuration may also be used in which oneemitter trench 63 is formed in each area surrounded by the loopedtrenches 10.

The emitter trenches 63 are formed so as to integrally continue from thelooped trenches 10. More specifically, the emitter trenches 63 areformed in a stripe shape in a plan view in the lengthwise direction ofthe looped trenches 10 in the areas surrounded by the looped trenches10, and continue from the looped trenches 10 at the respective shortsides thereof. The emitter trenches 63 have the same cross-sectionalshape as the looped trenches 10. In other words, a width W₃ of theemitter trenches 63 is the same width as the width W₁ of the loopedtrenches 10. The emitter trenches 63 are formed at the same depth as thelooped trenches 10.

A pair of second emitter connecting parts 64 are formed in a stripeshape in a plan view in the respective emitter trenches 63 through aninsulating film 18. The pair of second emitter connecting parts 64 havea similar configuration to the trench gates 19 and the emitterconnecting parts 20 in Embodiment 1 described above. In other words, thepair of second emitter connecting parts 64 are formed in the respectiveemitter trenches 63 with gaps therebetween and are insulated from eachother. More specifically, the pair of second emitter connecting parts 64are each formed separated from each other in a film-like shape along therespective side faces of the emitter trenches 63 in the cross sectionshown in FIG. 7. There are spaces in the widthwise center of the emittertrenches 63, and these spaces are demarcated by the respective rearsurfaces of the pair of second emitter connecting parts 64 (the side ofthe second emitter connecting parts 64 opposite to the side contactingthe emitter trenches 63). These spaces are completely filled to theopening of the emitter trenches 63 by a center insulating film 21,thereby insulating the second emitter connecting parts in the pairs ofsecond emitter connecting parts from each other.

The pairs of second emitter connecting parts 64 are each joined to therespective p-type floating regions 62 through the insulating film 18.The pairs of second transmitter junctions 64 are formed so as tointegrally continue from emitter connecting parts 20 on the respectiveshort sides of the looped trenches 10. Due to this, power is suppliedfrom an emitter electrode 6 to the second emitter connecting parts 64through the emitter connecting parts 20. The pair of second emitterconnecting parts 64 are made of the same material as the trench gates 19and the emitter connecting parts 20.

To form this type of semiconductor device 61, the layout of the hardmask 51 should be changed so as to form the emitter trenches 63 in thestep of forming the looped trenches 10 in FIG. 6B described above, forexample. Thereafter, the second emitter connecting parts 64 can beformed through the same step as the step in which the trench gates 19and the emitter connecting parts 20 are formed (see FIGS. 6E to 6H).

As described above, even with the configuration of the semiconductordevice 61 according to Embodiment 2, similar effects to thesemiconductor device 1 of Embodiment 1 described above can be achieved.

FIG. 8 is a schematic cross-sectional view of a semiconductor device 81according to Embodiment 3 of the present invention. The semiconductordevice 81 of Embodiment 3 differs from the semiconductor device 61 inEmbodiment 2 in that emitter trenches 83 are formed with relativelynarrow widths compared to looped trenches 10. Other elements are similarto the semiconductor device 61 according to Embodiment 2 describedabove. In FIG. 8, portions corresponding to the portions in FIG. 7 areassigned the same reference characters and descriptions thereof will beomitted.

A plurality of the emitter trenches 83 are formed with a narrower widththan a width W₁ of the looped trenches 10 in areas surrounded by thelooped trenches 10. A width W₄ of the emitter trenches 83 is formed atthe same width as a width W₂ of the gate contact trenches 11 and emittercontact trenches 12 described above (see FIG. 2B), for example, ornamely, 0.7 μm to 1.2 μm. In the present embodiment, an example is shownin which three of the emitter trenches 83 are formed, but aconfiguration may be used in which one or two of the emitter trenches 83are formed. A configuration may also be used in which more than three ofthe emitter trenches 83 are formed.

In contrast to Embodiment 2 described above, in the present embodiment,pairs of second emitter connecting parts 64 are not formed, but rathersecond emitter connecting parts 84 are embedded as a whole in therespective emitter trenches 83.

As described above, even with the configuration of the semiconductordevice 81, it is possible to attain effects similar to those describedin Embodiment 2. The width W₄ of the emitter trenches 83 is less than awidth W₁ of the looped trenches 10. Accordingly, in the step in FIG. 6Edescribed above, it is possible to completely fill the emitter trenches83, which have the width W₄ narrower than the looped trenches 10, with apolysilicon deposition layer 52 and to obtain the second emitterconnecting parts 84 that are embedded in these emitter trenches 83 byfollowing the same operating principle in which the respective contacttrenches 11 and 12 having a relatively narrow width are completelyfilled by the polysilicon deposition layer 52.

FIG. 9 is a schematic cross-sectional view of a semiconductor device 91according to Embodiment 4 of the present invention. The semiconductordevice 91 of Embodiment 4 differs from the semiconductor device 1 ofEmbodiment 1 in that a semiconductor substrate 15 has an n⁻ bufferregion 92; there are no contact trenches 29; and a p⁺ base contactregion 30 and a portion of an n⁺ emitter region 31 is therefore exposedon the surface of the semiconductor substrate 15. Other elements aresimilar to the semiconductor device 1 according to Embodiment 1described above. In FIG. 9, portions corresponding to the portions inFIG. 2A are assigned the same reference characters and descriptionsthereof will be omitted.

The semiconductor substrate 15 according to the semiconductor device 91has the n⁻ buffer region 92 interposed between a p⁺ collector region 16and an n⁻ drain region 17. The dopant concentration of the n⁻ bufferregion 92 is 1×10¹⁵ cm⁻³ to 5×10¹⁷ cm⁻³, for example.

This type of n⁻ buffer region 92 can be formed by selectively implantingthe n-type dopant into the rear surface side of the semiconductorsubstrate 15 in the step shown in FIG. 6K described above and before thestep of forming the p⁺ collector region 16.

Tungsten contacts 93 constituted of tungsten are formed in respectivecontact holes 35 of the semiconductor device 91. The tungsten contacts93 are connected to the p⁺ base contact regions 30 and portions of then⁺ emitter regions 31 on the surface of the semiconductor substrate 15.An emitter electrode 6 is connected to the p⁺ base contact regions 30and embedded emitter electrodes 25 through the tungsten contacts 93. Agate finger 2 is connected to embedded gate electrodes 24 through thetungsten contacts 93.

As described above, with the semiconductor device 91, the tungstencontacts 93 are formed in the respective contact holes 35; therefore, itis possible to achieve favorable contact. Accordingly, the contacttrenches 29 do not need to be separately formed in the step shown inFIG. 6J. Furthermore, when the emitter electrode 6 and the gate finger 2are formed in the step shown in FIG. 6K, the tungsten should be embeddedin the respective contact holes 35; therefore, the manufacturing processis not needlessly complicated. In this manner, even with theconfiguration of the semiconductor device 91, it is possible to attaineffects similar to those described in Embodiment 1.

FIG. 10 is a schematic plan view of a semiconductor device 101 accordingto Embodiment 5 of the present invention.

As shown in FIG. 10, the semiconductor device 101 is formed in anequilateral chip shape in a plan view seen from a direction normal tothe surface of the semiconductor device 101 (hereinafter, referred tosimply as a “plan view”), for example. An active area 102 and an endarea 113 that surrounds this active area 102 are defined on thesemiconductor device 101. The active area 102 is formed in asubstantially equilateral shape in a plan view on the semiconductordevice 101. A plurality of gate trenches 137 are formed in stripe shapeson the active area 102.

A gate metal 103, which is one example of a surface gate metal thatselectively surrounds the active area 102, and an emitter electrode 104that selectively covers the active area 102 is formed on the surface ofthe semiconductor device 101. In FIG. 10 cross-hatching has been addedto the gate metal 103 and the emitter electrode 104 for clarity. Thegate metal 103 includes a gate pad 105 that is one example of a padsection, and a wiring section 167 constituted of a gate finger 106 and apad peripheral section 107.

The gate pad 105 is formed in a substantially equilateral shape in aplan view in the lengthwise center of an area of the semiconductordevice 101 that goes along a side 101 a. The gate pad 105 receivesexternal power by connecting to bonding wiring 108. The gate pad 105 ismade of a metal material that includes Al (aluminum) as a main componentthereof, for example.

The gate finger 106 is formed in a line shape so as to surround theactive area 102 of the semiconductor device 101. More specifically, thegate finger 106 extends from the side of the gate pad 105 towards thestripe direction of the gate trenches 137 in a plan view (in otherwords, the direction along the side 101 a of the semiconductor device101) and also extends towards a direction orthogonal to the stripedirection, which intersects the side 101 a at a right angle (in otherwords, the direction along a side 101 b and a side 101 c facing the side101 b). The pad peripheral section 107 is formed around the gate pad 105and surrounds a first removal area 110.

In Embodiment 5, an example is described in which the gate pad 105 isdisposed in the lengthwise center of an area along the side 101 a of thesemiconductor device 101, but the gate pad 105 may be formed on a cornerof the semiconductor device 101. In Embodiment 5, an example is shown inwhich the gate finger 106 is not formed on the side 101 d facing theside 101 a of the semiconductor device 101, but the gate finger 106 maybe formed around the entire semiconductor device 101.

The first removal area 110 is formed in a substantially equilateral loopin a plan view so as to surround the gate pad 105. The first removalarea 110 is an area where the metal material has been removed, and thismakes it so the gate pad 105 and the pad peripheral section 107 do notcontact each other. In Embodiment 5, an example is described in whichthe first removal area 110 is formed in a loop shape that surrounds theentirety of the gate pad 105, but the first removal area 110 mayselectively surround a portion of the gate pad 105.

The pad peripheral section 107 is formed in a substantially equilateralloop so as to surround the gate pad 105 in a plan view. The padperipheral section 107 is formed so as to integrally continue from thegate finger 106 on the side of the gate pad 105. A second removal area111 that selectively surrounds the first removal area 110 is formed onthe pad peripheral section 107, and this demarcates the pad peripheralsection 107 into an inner area 107 a surrounded by the first removalarea 110 and the second removal area 111, and an outer area 107 b thatsurrounds this inner area 107 a.

The emitter electrode 104 is formed in the area of the semiconductordevice 101 demarcated by the gate metal 103 across a third removal area112. The third removal area 112 is formed in a line shape along the gatemetal 103. The emitter electrode 104 is formed so as to cover the activearea 102. First lead out wiring 115, gate finger lead out wiring 116,and second lead out wiring 117 (see FIG. 11) are formed across aninterlayer insulating film 145 (see FIG. 13A) in an area that is a layerbelow the gate metal 103 and the emitter electrode 104.

FIG. 11 is a schematic plan view for explaining the first lead outwiring 115, the gate finger lead out wiring 116, and the second lead outwiring 117 of the semiconductor device 101 according to Embodiment 5.FIG. 12 is a plan view in which the first lead out wiring 115, the gatefinger lead out wiring 116, and the second lead out wiring 117 of thesemiconductor device 101 shown in FIG. 10 have been magnified.

As shown in FIG. 11, the first lead out wiring 115 is formed in a closedgroup structure in a plan view so as to straddle the gate pad 105 andthe pad peripheral section 107 in a layer below the gate pad 105. Morespecifically, the first lead out wiring 115 is formed in an equilateralloop from the gate pad 105 to the inner area 107 a of the pad peripheralsection 107 across the first removal area 110. It is preferable that thefirst lead out wiring 115 be made of a material having a higherresistance than the gate metal 103, such as an electrode material suchas polysilicon, for example.

As shown in FIGS. 12 and 13A, the first lead out wiring 115 iselectrically connected to the gate pad 105 through a gate pad contact118 and electrically connected to the pad peripheral section 107 througha first pad peripheral section contact 119. The gate pad contact 118 isformed in an equilateral loop in a plan view surrounding the gate pad105. Meanwhile, the first pad peripheral section contact 119 is formedin an equilateral loop in a plan view surrounding the first removal area110 in the inner area 107 a of the pad peripheral section 107. In thismanner, the gate pad 105 is electrically connected to the pad peripheralsection 107 and the gate finger 106 via the first lead out wiring 115.

The gate finger lead out wiring 116 is formed in a layer below the gatefinger 106. The gate finger lead out wiring 116 has a narrower widththan the gate finger 106 and is completely covered by the gate finger106. The gate finger lead out wiring 116 is made of the same electrodematerial as the first lead out wiring 115. As shown in FIG. 12, the gatefinger lead out wiring 116 is electrically connected to the gate finger106 via a gate finger contact 120.

The second lead out wiring 117 is formed having a prescribed gap fromthe first lead out wiring 115 and selectively surrounds the first leadout wiring 115. The second lead out wiring 117 is formed so as tostraddle the pad peripheral section 107 and the active area 102. Morespecifically, the second lead out wiring 117 is formed so as to goacross the second removal area 111, the outer area 107 b of the padperipheral section 107, and the third removal area 112 from the innerarea 107 a of the pad peripheral section 107. The second lead out wiring117 integrally continues from the gate finger lead out wiring 116 on aside of the area where the gate pad 105 is formed. The second lead outwiring 117 is formed of the same electrode material as the first leadout wiring 115.

As shown in FIG. 12, the second lead out wiring 117 is electricallyconnected to the inner area 107 a of the pad peripheral section 107 viaa second pad peripheral section contact 121 and electrically connectedto the outer area 107 b of the pad peripheral section 107 via a thirdpad peripheral section contact 122. The second pad peripheral sectioncontact 121 is formed in a line shape selectively surrounding the firstpad peripheral section contact 119 in the inner area 107 a of the padperipheral section 107. Meanwhile, the third pad peripheral sectioncontact 122 is formed in a line shape surrounding the second removalarea 111 in the outer area 107 b of the pad peripheral section 107, andintegrally continues from the gate finger contact 120 on a side of thearea where the gate pad 105 is formed. In this manner, the padperipheral section 107 is electrically connected to the gate finger 106through the second lead out wiring 117.

Next, a partial cross-sectional configuration of the semiconductordevice 101 will be explained using FIG. 13A. FIG. 13A is across-sectional view of FIG. 12 along XIIIA-XIIIA

As shown in FIG. 13A, the semiconductor device 101 includes asemiconductor substrate 125, which is one example of a semiconductorlayer. The semiconductor substrate 125 is an n⁻ silicon substrate, forexample, and is formed of a p⁺ collector region 126 and an n⁻ drainregion 127 layered in this order from the rear surface side thereof. Thep⁺ collector region 126 is formed on the entire rear surface of thesemiconductor substrate 125, and the n⁻ drain region 127 is formed onthe entire front surface of the semiconductor substrate 125. The dopantconcentration of the p⁺ collector region 126 is 5×10¹⁵ cm⁻³ to 2×10¹⁹cm⁻³, for example. The p-type dopant can be B (boron), Al (aluminum), orthe like, for example (the same for hereinafter). The dopantconcentration of the n⁻ drain region 127 is 5×10¹³ cm⁻³ to 1×10¹⁵ cm⁻³,for example. The n-type dopant can be N (nitrogen), P (phosphorous), As(arsenic), or the like, for example (the same for hereinafter).

A plurality of the gate trenches 137 are formed in a stripe shape on theactive area 102 of the semiconductor substrate 125. Areas having auniform width are disposed between the plurality of gate trenches 137,and an IGBT single cell 136 is formed in each of these areas.

The gate trenches 137 are dug from the surface of the semiconductorsubstrate 125. More specifically, the gate trenches 137 are formed at auniform width and have side faces that are approximately perpendicularto the surface of the semiconductor substrate 125 and a top opening thatis formed so as to be on the same level as the surface of thesemiconductor substrate 125.

The single cells 136 are formed along the stripe direction of the gatetrenches 137 and each includes a p-type base region 140, a p⁺ basecontact region 141, and n⁺ emitter regions 142 formed above this p-typebase region 140.

The p-type base region 140 is shared by the gate trench 137 on one sidethereof and the gate trench 137 on the other side thereof. The bottom ofthe p-type base region 140 is closer to the surface side of thesemiconductor substrate 125 than the bottom of the gate trenches 137.The dopant concentration of the p-type base region 140 is 1×10¹⁶ cm⁻³ to1×10¹⁸ cm⁻³, for example.

The n⁺ emitter regions 142 are formed on the surface of thesemiconductor substrate 125. One each of the n⁺ emitter regions 142 isdisposed on both side faces of the gate trenches 137 and each is exposedto the side faces of the gate trenches 137. The dopant concentration ofthe n⁺ emitter region 142 is 1×10¹⁹ cm⁻³ to 1×10²¹ cm⁻³, for example.Meanwhile, the p⁺ base contact region 141 is sandwiched between the n⁺emitter regions 142. The dopant concentration of the p⁺ base contactregion 141 is 1×10¹⁹ cm⁻³ to 1×10²¹ cm⁻³, for example.

An insulating film 134 is formed on the surface of the semiconductorsubstrate 125 and the inner surface (side faces and bottom) of the gatetrenches 137. The insulating film 134 is an insulating material made ofsilicon oxide (SiO₂), silicon nitride (SiN), aluminum oxide (Al₂O₃), orthe like, for example. Gate electrodes 138 are embedded in therespective gate trenches 137 through the insulating film 134.

The gate electrodes 138 are embedded in the respective gate trenches 137such that the top surface of the gate electrode 138 exposed from thegate trench 137 is at the same level as the top surface of thesemiconductor substrate 125. It is preferable that the electrodematerial of the gate electrodes 138 be the same electrode material asthe first and second lead out wiring 115 and 117, for example. In thiscase, it is possible to form the first and second lead out wiring 115and 117 in the same step as the gate electrodes 138, which can simplifythe manufacturing process.

The first and second lead out wiring 115 and 117 and the gate fingerlead out wiring 116 (see FIG. 11) are formed on the surface of thesemiconductor substrate 125 across the insulating film 134. The secondlead out wiring 117 includes a drawn out part 117 a that is drawn outfrom the active area 102 along the direction going across the stripes.

The gate electrodes 138 are electrically connected to the gate fingerlead out wiring 116 on both ends in the lengthwise direction of the gatetrenches 137, and the lead out wiring line 116 is formed so as to goacross the gate trenches 137. This electrically connects the gateelectrodes 138 to the gate finger 106 via the gate finger lead outwiring 116. As shown in FIG. 13A, the gate electrodes 138 areelectrically connected to the drawn out part 117 a. This electricallyconnects the gate electrodes 138 to the pad peripheral section 107 viathe drawn out part 117 a. The second lead out wiring 117 may have thedrawn out part 117 a (see FIGS. 11 and 12) that is drawn out from theactive area 102 along the stripe direction, and this may electricallyconnect the second lead out wiring 117 to the pad peripheral section107.

The interlayer insulating film 145 is formed on the surface of thesemiconductor substrate 125. Emitter contact holes 147 that selectivelyexpose the p⁺ base contact regions 141 and portions of the n⁺ emitterregions 142 are formed in the interlayer insulating film 145 in theactive area 102. The gate pad contact 118, the first pad peripheralsection contact 119, the gate finger contact 120 (see FIG. 12), thesecond pad peripheral section contact 121, and the third pad peripheralsection contact 122 are respectively formed in the interlayer insulatingfilm 145 in the end area 113. The interlayer insulating film 145 is aninsulating material made of tetraethyl orthosilicate (TEOS), boronphosphorous silicate glass (BPSG), silicon oxide (SiO₂), or the like,for example.

The gate metal 103 and the emitter electrode 104 are formed on theinterlayer insulating film 145. The emitter electrode 104 iselectrically connected to the p⁺ base contact regions 141 and portionsof the n⁺ emitter regions 142 via the emitter contact holes 147.

Meanwhile, as described above, the gate metal 103 is electricallyconnected to the first and second lead out wiring 115 and 117 via therespective contacts 118, 119, 121, and 122. This electrically connectsthe gate metal 103 to the gate electrodes 138 via the first and secondlead out wiring 115 and 117 and the drawn out part 117 a of the secondlead out wiring 117, thereby forming a current pathway that leadssurface current from the gate pad 105 to the gate electrodes 138.

A surface protective film 146 is formed on the interlayer insulatingfilm 145 so as to selectively cover the area between the gate pad 105and the emitter electrode 104. The surface protective film 146 is madeof a resin, for example.

The semiconductor device 101 is expressed by the electrical circuit mapshown in FIG. 13B. FIG. 13B is an electrical circuit map for explainingthe electrical structure of the semiconductor device 101 shown in FIG.10.

As shown in FIG. 13B, the semiconductor device 101 includes the gate pad105, and a current restricting unit 139 interposed between the gate pad105 and gate electrodes 138. The current restricting unit 139 includes aresistance component of the first lead out wiring 115, a resistancecomponent of the gate finger lead out wiring 116, and a resistancecomponent of the second lead out wiring 117, which are connected inseries to the gate pad 105. When a voltage is applied to the gate pad105, current flows to the gate electrodes 138 through the currentrestricting unit 139.

As described above and shown in FIGS. 12, 13A, and 13B, with thisconfiguration of the semiconductor device 101, when current flows fromthe gate pad 105 to the pad peripheral section 107 and the gate finger106, this current passes through the first and second lead out wiring115 and 117 (the current restricting unit 139); therefore, it ispossible to restrict current flowing to the pad peripheral section 107and the gate finger 106 due to surface current at a position close tothe gate pad 105. This makes it possible to suppress an MIS gatestructure 132 from turning ON locally as a result of inrush current(di/dt) locally flowing to the gate electrodes 138 in the MIS gatestructure 132 at a position close to the gate pad 105 (in particular,the peripheral section of the gate pad 105 that is electricallyconnected via the pad peripheral section 107). As a result, it ispossible to suppress variation in the applied current between therespective MIS gate structures 132 regardless of distance from the gatepad 105.

Even if inrush current flows to the inner area 107 a of the padperipheral section 107 from the gate pad 105, this inrush current willpass through the second lead out wiring 117 or go around the thirdremoval area 112 and flow to the outer area 107 b of the pad peripheralsection 107. In other words, it is possible to doubly restrict currentflowing to the gate electrodes 138 at the peripheral section of the gatepad 105. Accordingly, it is possible to effectively restrict inrushcurrent flowing to the gate electrodes 138 of the MIIS gate structures132 arranged in the vicinity of the gate pad 105. Meanwhile, the gatefinger 106 contacts the gate electrodes 138 of the MIS gate structures132 at a relatively far position from the gate pad 105, which allows forinrush current to be restricted.

When the switching characteristics of the semiconductor device 101 wereinvestigated, the graphs shown in FIGS. 14A to 14C were obtained.

FIG. 14A to 14C are graphs showing switching characteristics of thesemiconductor device 101 shown in FIG. 10.

FIG. 14A shows the relationship between a voltage V_(GE) (V) between thegate emitters of the semiconductor device 101 and time (nsec), FIB. 14Bshows the relationship between a voltage V_(CE) (V) between thecollector emitters of the semiconductor device 101 and time (nsec), andFIG. 14C shows a relationship between a collector current I_(C) (A) ofthe semiconductor device 101 and time (nsec). In FIGS. 14A to 14C, thecharacteristics of the semiconductor device 101 are shown with a solidline, and the switching characteristics of a semiconductor device 148according to a reference example are shown with a dotted line. Thesemiconductor device 148 according to the reference example does nothave the first and second lead out wiring 115 and 117.

As shown in FIG. 14A, in the semiconductor device 148 of the referenceexample, noise is generated at the voltage V_(GE) at the gate emittersduring a turn ON time t_(on). In contrast, in the semiconductor device101, there is no noise such as that in the semiconductor device 148 ofthe reference example. The turn ON time t_(on) is defined as the timethat is necessary for the voltage V_(CE) between the collector emittersto fall to 10% of the maximum value thereof from the start of thevoltage V_(GE) between the gate emitters during turn ON time of theIGBT.

As shown in FIG. 14B, in the semiconductor device 148 of the referenceexample, noise can be confirmed to be generated at the voltage V_(CE)between the collector emitters during a rise time t_(r). In contrast, inthe semiconductor device 101, there is no noise such as that in thesemiconductor device 148 of the reference example. The rise time t_(r)is defined as the time that is necessary for the voltage V_(CE) betweenthe collector emitters to fall to 10% of the maximum value thereof fromthe time when the collector current I_(C) rises to 10% of the maximumvalue thereof during turn ON of the IGBT.

As shown in FIG. 14C, in the semiconductor device 148 of the referenceexample, noise can be confirmed to be generated at the collector currentI_(C) during reverse recovery time t_(rr). In contrast, in thesemiconductor device 101, there is no noise such as that in thesemiconductor device 148 of the reference example. Reverse recovery timet_(rr) is defined as the time that is necessary for the reverse recoverycurrent of the internal diodes to disappear. In the semiconductor device101, while the peak current value is lower than the semiconductor device148 of the reference example, there is almost no change in the effectivecurrent value. This is because current other than the current detectedas effective current, or namely, the surface current (inrush current)flowing to the target metal 103, flows to the gate electrodes 138 viathe first and second lead out wiring 115 and 117.

The generation of noise in the semiconductor device 148 of the referenceexample will be explained next using FIGS. 14A to 14C. Namely, theparasitic inductance or parasitic capacitance normally forms an LCresonant circuit on the gate pad 105 formed around the MIS gatestructures 132, the pad peripheral section 107, and the gate finger 106.Therefore, when surface current flows, the switching of the MIS gatestructures 132 acts as a trigger for generating the resonance noise. Inthe semiconductor device 148 according to the reference example, thereis no first and second lead out wiring 115 and 117, and thus it is notpossible to restrict this type of surface current. Accordingly, in thesemiconductor device 148 according to the reference example, waveformsof the resonance noise are detected as shown in FIGS. 14A to 14C.

In contrast, according to the configuration of the semiconductor device101, it is possible to restrict current flowing to the pad peripheralsection 107 and the gate finger 106 due to surface current, and thus itis possible to suppress the MIS gate structures 132 turning ON locally.Therefore, it is possible to suppress the switching of the MIS gatestructures 132 triggering the generation of the resonance noise.Therefore, it is possible to reduce switching loss caused by resonancenoise during switching ON.

In the manner described above, it is possible to provide a semiconductordevice 101 that can effectively restrict inrush current and that canreduce switching loss and the generation of resonance noise.

FIG. 15 is a schematic plan view of a semiconductor device 151 accordingto Embodiment 6 of the present invention. FIG. 16 is a schematic planview for explaining a first and second lead out wiring 160 and 161 ofthe semiconductor device 151 according to Embodiment 6. Thesemiconductor device 151 in Embodiment 6 differs from the semiconductordevice 101 in Embodiment 5 in that a gate metal 152 is formed instead ofthe gate metal 103. Other elements are similar to the semiconductordevice 101 according to Embodiment 5 described above. In FIGS. 15 and16, portions corresponding to the portions in FIGS. 10 and 13A areassigned the same reference characters and descriptions thereof will beomitted. In a manner similar to Embodiment 5 described above, thesemiconductor device 151 is formed in an equilateral chip shape in aplan view, and a plurality of gate trenches 137 are formed in stripeshapes on an active area 102.

As shown in FIG. 15, the gate metal 152, which is one example of asurface gate metal, is formed on an end area 113 of the semiconductordevice 151 so as to selectively surround an active area 102. The gatemetal 152 includes a gate pad 153, which is one example of a padsection, a first gate finger 154, a second gate finger 155, and a wiringsection 168 made of a pad peripheral section 156.

In Embodiment 6, the gate pad 153 is formed on one corner of thesemiconductor device 151. The gate pad 153 receives external power byconnecting to bonding wiring 108.

The first gate finger 154, the second gate finger 155, and the padperipheral section 156 are formed in line shapes so as to surround theactive area 102 of the semiconductor device 151.

The first gate finger 154 is formed so as to integrally continue fromthe gate pad 153. More specifically, the first gate finger 154 extendsfrom the gate pad 153 towards the stripe direction of the gate trenches137 (in other words, the direction along a side 151 a of thesemiconductor device 151) and also extends towards a directionorthogonal to the stripe direction, which intersects the side 151 a at aright angle (in other words, a direction along another side 151 b.). Thefirst gate finger 154 is formed so as to go across an end in thelengthwise direction of the gate trenches 137 in an area along the side151 b of the semiconductor device 151.

The pad peripheral section 156 is formed so as to selectively surroundthe inner sides of the gate pad 153 across a removal area 157. Theremoval area 157 is formed in a line shape along the periphery of thegate pad 153. In other words, the pad peripheral section 156 is isolatedfrom the gate pad 153 and the first gate finger 154 by this removal area157.

The second gate finger 155 is formed along a side 151 c that faces theside 151 b of the semiconductor device 151. More specifically, thesecond gate finger 155 is formed so as to go across the other end in thelengthwise direction of the gate trenches 137 from the gate pad 153 andso as to integrally continue from an end 156 a of the pad peripheralsection 156. In other words, the second gate finger 155 is also isolatedfrom the gate pad 153 and the first gate finger 154.

As shown in FIG. 16, the first lead out wiring 160 and the second leadout wiring 161 are formed in an area below the gate metal 152.

The first lead out wiring 160 is formed so as to straddle the first gatefinger 154 and the second gate finger 155. More specifically, the firstlead out wiring 160 goes across the area where the removal area 157 isformed, and is formed along the area where the first gate finger 154,the gate pad 153, and the second gate finger 155 are formed. The firstlead out wiring 160 is formed having a greater width than the first gatefinger 154 and the second gate finger 155. It is preferable that thefirst lead out wiring 160 be made of a material having a higherresistance than the gate metal 152, such as an electrode material suchas polysilicon, for example.

The second lead out wiring 161 is formed along the area where the padperipheral section 156 is formed. The second lead out wiring 161 isformed having a greater width than the pad peripheral section 156. Thesecond lead out wiring 161 is formed so as to integrally continue fromthe first lead out wiring 160 on the side of the area where the secondgate finger 155 is formed. The end 161 a of the second lead out wiring161 on the gate pad 153 side goes across the removal area 157 to thegate pad 153.

As shown in FIGS. 15 and 16, the gate pad 153 and the first gate finger154 are electrically connected to the first lead out wiring 160 througha first contact 162 formed along the gate pad 153 and the first gatefinger 154.

Meanwhile, the pad peripheral section 156 and the second gate finger 155are electrically connected to the first lead out wiring 160 through asecond contact 163 formed along the second gate finger 155. In otherwords, the gate pad 153 is electrically connected to the pad peripheralsection 156 and the second gate finger 155 via the first lead out wiring160.

The first and second lead out wiring 160 and 161 are electricallyconnected to gate electrodes 138 embedded in the respective gatetrenches 137, in a manner similar to Embodiment 5. This electricallyconnects the gate metal 152 to the gate electrodes 138 via the first andsecond lead out wiring 160 and 161, thereby forming a current pathwaythat leads surface current from the gate pad 153 to the gate electrodes138.

As described above, in the semiconductor device 151, the first gatefinger 154 does not contact the gate electrodes 138 at the portion ofthe first gate finger extending along the MIS gate structures 132 fromthe corner gate pad 153 to the adjacent corners, but rather contacts thegate electrodes 138 at the side that is opposite to the gate pad 153. Inother words, the first gate finger 154 contacts the gate electrodes 138of the MIS gate structures 132 at a position that is relatively far fromthe gate pad 153, which allows for inrush current to be restricted.Meanwhile, the second gate finger 155 and the pad peripheral section 156contact the gate electrodes 138 of the MIS gate structures 132 at aposition that is relatively close to the gate pad 153, but the secondgate finger 155 is isolated from this gate pad 153. Furthermore, thesecond gate finger 155 and the pad peripheral section 156 areelectrically connected to the gate pad 153 via the first and second leadout wiring 160 and 161; therefore, even if inrush current flows to thegate pad 153, this inrush current can be restricted. Accordingly,effects that are similar to those described in Embodiment 5 can beachieved.

Embodiments of the present invention as well as aspects related toEmbodiment 5 and Embodiment 6 were described above, but the presentinvention can also be achieved with other aspects.

In Embodiments 2 and 3, for example, an example was described in whichstripe-shaped emitter trenches 63 and 83 were formed in the lengthwisedirection of the looped trenches 10, but the emitter trenches 63 and 83may be formed in stripe shapes in the short side direction of the loopedtrenches 10 in a plan view. The emitter trenches 63 and 83 may be formedin a mesh shape inside the looped trenches 10.

In several embodiments above, an example was described in which the gatecontact trenches 11 and the emitter contact trenches 12 are formed in anangular bridge-like shape in a plan view, but other structures such asan arc-like shape, a triangular bridge-like shape, or the like may beused, for example.

In Embodiments 1 to 4 and the modification examples thereof, an examplewas described in which the bottoms of the respective trenches 10, 11,12, 63, and 83 are rounded from the side faces thereof, but the bottomsof the respective trenches 10, 11, 12, 63, and 83 may be formedhorizontally.

Furthermore, in Embodiments 1 to 4 and the modification examplesthereof, an example was described in which IGBTs are formed in theactive area 4, but a CMOS (complementary MOS) may be formed instead ofthe IGBT. The example shown in FIG. 17 may be used as the configurationhaving the MOS structure, for example.

FIG. 17 is a schematic cross-sectional view showing a modificationexample of the semiconductor device 1 according to Embodiment 1. In FIG.17, the same reference characteristics are given to the primary elementsshared with the semiconductor device 1, and an explanation thereof willnot be repeated.

As shown in FIG. 17, in this modification example, a semiconductordevice 94 has an n⁺ drain region 95 instead of the p⁺ collector region16. In other words, in the semiconductor device 94, MOSFETs are formedinstead of IGBTs. In this case, a source electrode 96 (n⁺ source region97) is provided instead of the emitter electrode 6 (n⁺ emitter region31) for the IGBT. Needless to say, the respective semiconductor devices61, 81, 91 in Embodiments 2 to 4 may use the n⁺ drain region 95 insteadof the p⁺ collector region 16 and may have MOSFET structures.

In several of the embodiments described above, an example was describedin which IGBTs were formed in the active area 4, but various types ofsemiconductor elements and circuit elements such as BJTs (bipolarjunction transistors), JFETs (junction field effect transistors),capacitors, resistors, and the like may be formed instead of the IGBTs.Furthermore, an integrated circuit such as an LSI (large scaleintegration), SSI (small scale integration), MSI (medium scaleintegration), VLSI (very large scale integration), ULSI (ultra verylarge scale integration), and the like may be formed by combinations ofthese semiconductor elements, circuit elements, and the like.

In the respective embodiments described above, a configuration ispossible in which the conductivity type of the various semiconductorregions, such as the p-type floating region 9, the p⁺ collector region16, and the n⁻ drain region 17 is inverted. Accordingly, in this case,the p-type floating region 9 would be an n-type floating region, the p⁺collector region 16 would be an n⁺ collector region, and the n⁻ drainregion 17 would be a p-type drain region. Needless to say, theconductivity type of the other semiconductor regions would also beflipped.

As shown in FIG. 18, the respective semiconductor devices 1, 61, 81, and91 in Embodiments 1 to 4 can be applied to an inverter circuit.

FIG. 18 is a circuit map for explaining an inverter circuit 201 to whichthe respective semiconductor devices 1, 61, 81, and 91 of Embodiments 1to 4 are applied.

The inverter circuit 201 is a three-phase inverter circuit that connectsto a three-phase motor 202 as a load. The inverter circuit 201 includesa direct power source 203 and a switch unit 204.

The direct power source 203 is 700V, for example. A high voltage wiringline 205 is connected to the high voltage side of the direct powersource 203, and a low voltage wiring line 206 is connected to the lowvoltage side. The switch unit 204 has three arms 207 to 209corresponding to respective phases of the three-phase motor 202: U-phase202U, V-phase 202V, and W-phase 202W.

The arms 207 to 209 are connected in parallel between the high voltagewiring line 205 and the low voltage wiring line 206. The arms 207 to 209respectively have high side transistors 210H to 212H on the high voltageside (semiconductor devices 1, 61, 81, and 91), and low side transistors210L to 212L (semiconductor devices 1, 61, 81, and 91) on the lowvoltage side. Freewheeling diodes 213H to 215H and 213L to 215L arerespectively connected in parallel to the transistors 210H to 212H and210L to 212L at an orientation such that forward current flows from thelow voltage side to the high voltage side.

In the inverter circuit 201, alternating current is sent to thethree-phase motor 202 by alternately switching ON/OFF control of thehigh side transistors 210H to 212H and the low side transistors 210L to212L of the respective arms 207 to 209, or in other words, byalternately switching states in which one transistor is switched ON andthe other transistor is switched OFF. Meanwhile, power to thethree-phase motor 202 can be stopped by switching OFF both transistors.In this manner, switching operation of the three-phase motor 202 isperformed.

In Embodiment 5 described above, an example was described in which thefirst removal area 110 is formed in a looped shape so as to surround thegate pad 105 (see FIG. 10), but a plurality of the first removal areas110 may be formed in a looped shape so as to selectively surround thegate pad 105. In FIG. 10, the first removal area 110 does not have to beformed on the left side of the gate pad 105, for example. In this case,the pad peripheral section 107 and the gate finger 106 are electricallyconnected to the gate pad 105 via the metal constituting the gate metal103. In this case too, the first removal area 110 surrounding threesides of the gate pad 105 must be avoided in order for current suppliedto the gate pad 105 to flow to the pad peripheral section 107, thusmaking it possible to lightly reduce inrush current to the padperipheral section 107.

In Embodiment 5 described above, an example was described in which thesecond removal area 111 selectively surrounds a portion around the gatepad 105 (see FIG. 10), but the second removal area 111 may surround theentirely of the gate pad 105.

In Embodiment 5 described above, an example was described in which thefirst lead out wiring 115 is formed in a closed loop shape in a planview in a layer under the gate pad 105, but the first lead out wiring115 may be formed in a looped shape as long as the gate pad 105electrically connects to the pad peripheral section 107. Accordingly,the first lead out wiring 115 may be formed in a line shape in an areaunder the gate pad 105.

In Embodiment 5 described above, an example was described in which thegate finger lead out wiring 116 is formed having a narrower width thanthe gate finger 106 (see FIG. 11), but the gate finger lead out wiring116 may be formed having a greater width than the gate finger 106.

In Embodiment 5 described above, an example was described in which thesecond lead out wiring 117 is formed so as to selectively surround thefirst lead out wiring 115 (see FIG. 11), but the second lead out wiring117 may be formed so as to surround the entirely of the first lead outwiring 115. In this case, the second pad peripheral section contact 121(see FIG. 12) may be formed in a square looped shape in a plan view soas to surround the entirely of the first pad peripheral section contact119.

In Embodiment 6 described above, an example was described in which theremoval area 157 is formed along the gate pad 153 (see FIG. 15), but theremoval area 157 may be formed so as to surround the entirety of thegate pad 153. In this case, the first gate finger 154 is also formedisolated from the gate pad 153. Even with this type of configuration,the first lead out wiring 160 is formed so as to straddle the gate pad153 and the first gate finger 154, thus making it possible toelectrically connect the gate pad 153 and the first gate finger 154.Accordingly, surface current flowing through the surface of the gate pad153 can also be restricted between the gate pad 153 and the gate finger154.

In Embodiments 5 and 6 described above, an example was described inwhich the gate trenches 137 are formed in the active area 102 in stripeshapes in a plan view, but the gate trenches 137 may be formed in a meshshape in a plan view. In this case, the single cells 136 of the IGBTsare formed in an area surrounded by the mesh-shaped gate trenches 137.

In Embodiments 5 and 6 described above, an example was described inwhich the IGBTs are formed in the active area 102, but the example shownin FIG. 19 may be adopted.

FIG. 19 is a schematic cross-sectional view showing a modificationexample of the semiconductor devices 101 and 151 according toEmbodiments 5 and 6. In FIG. 19, the same reference characteristics aregiven to the primary elements shared with the semiconductor devices 101and 151, and an explanation thereof will not be repeated.

As shown in FIG. 19, in this modification example, a semiconductordevice 191 has an n⁺ drain region 192 instead of a p⁺ collector region126. In other words, in the semiconductor device 191, MOSFETs are formedinstead of IGBTs. In this case, a source electrode 193 (n⁺ source region194) of the MOSFETs is provided instead of the emitter electrode 104 (n⁺emitter region 142) of the IGBTs.

Even with this type of configuration, the gate electrode 183 of MIS gatestructures 132 in the MOSFETs can be suppressed from turning ON locally,which makes it possible for effects similar to those with the IGBTs tobe attained. Furthermore, a semiconductor substrate 125 may use SiC(silicon carbide) to form SiC-IGBT, or may form a SiC-MOSFET.

In Embodiments 5 and 6 described above, an example was described inwhich trench-gate IGBTs are formed in the active area 102, but aplanar-gate IGBT having a gate electrode formed on the surface of thesemiconductor substrate 125 across an insulating film 134 may beadopted. Furthermore, planar-gate MOSFETs may be adopted instead of theplanar-gate IGBTs.

In Embodiments 5 and 6 described above, an example was described inwhich the bottom of the gate trenches 137 are formed in parallel to thesurface of the semiconductor substrate 125, but the bottom of the gatetrenches 137 may be formed so as to be rounded from the side facesthereof. In Embodiments 5 and 6 described above, an example wasdescribed in which the side faces of the gate trenches 137 are formed ata right angle to the surface of the semiconductor substrate 125, but theside faces of the gate trenches 137 may be formed in a tapered shapehaving a width that gradually narrows from the opening thereof towardsthe bottom.

In Embodiments 5 and 6 described above, an example was described inwhich the IGBTs are formed in the active area 102, but various types ofsemiconductor elements and circuit elements such as CMOS (complementaryMOS), BJTs (bipolar junction transistors), JFETs (function field effecttransistors), capacitors, resistors, and the like may be used instead ofthe IGBTs. Furthermore, an integrated circuit such as an LSI (largescale integration), SSI (small scale integration), MSI (medium scaleintegration), VLSI (very large scale integration), ULSI (ultra verylarge scale integration), and the like may be formed by combinations ofthese semiconductor elements, circuit elements, and the like.

In Embodiments 5 and 6 described above, a configuration may be used inwhich the conductivity type of the various semiconductor regions of thep⁺ collector region 126, the n⁻ drain region 127, the p-type baseregions 140, and the n⁺ emitter regions 142 are reversed.

As shown in FIG. 20, the semiconductor devices 101 and 105 described inEmbodiments 5 and 6 can be applied to an inverter circuit 221.

FIG. 20 is a circuit map for explaining the inverter circuit 221 towhich the semiconductor devices 101 and 151 of Embodiments 5 and 6 havebeen applied.

The inverter circuit 221 differs from the inverter circuit 201 shown inFIG. 18 in that high side transistors 222H to 224H (semiconductordevices 101 and 151) and low side transistors 222L to 224L(semiconductor devices 101 and 105) are provided instead of the highside transistors 210H to 212H and the low side transistors 210L to 212L.The other elements are similar to the inverter circuit 201 shown in FIG.18.

As shown in FIG. 20, the respective high side transistors 222H to 224Hand the low side transistors 222L to 224L have a current restrictingunit 139 interposed between the gate pad 105 and the gate electrode 138(see also FIG. 13B). Therefore, with these current restricting units139, it is possible to reduce switching loss caused by resonance noiseduring switching ON.

Embodiments 1 to 4 described above and the various modification examplesdescribed above can be appropriately combined with Embodiments 5 to 6described above and the various modification examples described above toexert the effects of both and to exert a synergy effect thereof. Thesetypes of diverse combinations are also embodiments of the presentinvention.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the invention. Thus, it isintended that the present invention cover modifications and variationsthat come within the scope of the appended claims and their equivalents.In particular, it is explicitly contemplated that any part or whole ofany two or more of the embodiments and their modifications describedabove can be combined and regarded within the scope of the presentinvention.

What is claimed is:
 1. A semiconductor device, comprising: asemiconductor layer having an active area in which a pluralitymetal-insulated-semiconductor gate structures are arrayed; a surfacegate metal that is disposed on the semiconductor layer and that has apad section for receiving external power, and a wiring section extendingaround the active area and electrically connected to respective gates ofthe plurality of metal-insulated-semiconductor gate structures, thesurface gate metal having a removal area for isolating at least aportion of the pad section and the wiring section; and lead out wiringthat is lead out from the pad section to the adjacent wiring sectionacross the removal section, the lead out wiring being made of a materialthat has a higher resistance than the surface gate metal.
 2. Thesemiconductor device according to claim 1, wherein the removal area isformed so as to surround the pad section.
 3. The semiconductor deviceaccording to claim 2, wherein the wiring section further includes aline-shaped gate finger that extends so as to surround the active area.4. The semiconductor device according to claim 3, wherein the wiringsection further includes a pad peripheral section integrally formed withthe gate finger and that surrounds the removal area that surrounds thepad section.
 5. The semiconductor device according to claim 3, whereinthe plurality of the metal-insulated-semiconductor gate structures areformed in a stripe shape as seen in a plan view from a direction normalto a surface of the semiconductor layer, and wherein the gate finger isdisposed so as to go across the stripe-shapedmetal-insulated-semiconductor gate structures, and the gate fingercontacts the gates of the metal-insulated-semiconductor gate structureson both lengthwise ends of the respective metal-insulated-semiconductorgate structures.
 6. The semiconductor device according to claim 5,wherein the pad section is formed in a center of an area along a stripedirection of the metal-insulated-semiconductor gate structures, andwherein the gate finger extends along both sides along the stripedirection from the pad section and goes across the stripe-shapedmetal-insulated-semiconductor gate structures.
 7. The semiconductordevice according to claim 5, wherein the semiconductor layer is formedin an equilateral shape in a plan view, wherein the pad section isformed on a corner of the equilateral semiconductor layer, and whereinthe gate finger is formed integrally with the pad section and furtherincludes a first gate finger disposed so as to extend along the stripedirection of the metal-insulated-semiconductor gate structures and asecond gate finger that is separated from the pad section through theremoval area and disposed so as to go across themetal-insulated-semiconductor gate structures from the pad section. 8.The semiconductor device according to claim 2, wherein the removal areaselectively surrounds a portion around the pad section.
 9. Thesemiconductor device according to claim 2, wherein the removal areacompletely surrounds an entirety of the pad section.
 10. Thesemiconductor device according to claim 1, wherein the lead out wiringconnects the pad section and the wiring section via a bottom part of theremoval area.
 11. The semiconductor device according to claim 10,wherein the wiring section is made of a metal material having Al as amain component thereof, and the lead out wiring and the gates of themetal-insulated-semiconductor gate structures are made of polysilicon.12. The semiconductor device according to claim 1, wherein each of themetal-insulated-semiconductor gate structures constitutes a part of aninsulated gate bipolar transistor formed in the semiconductor layer. 13.The semiconductor device according to claim 12, wherein said insulatedgate bipolar transistor is a trench-gate insulated gate bipolartransistor.